Engineering, Analysis and Solutions Lab (EASL)

Tobyhanna Army Depot (TYAD) is designated as the Center of Industrial and Technical Excellence for Command, Control, Communications, Computers, Cyber, Intelligence, Surveillance and Reconnaissance (C5ISR), electronics, avionics, and missile guidance and control. TYAD provides cradle-to-grave lifecycle support through depot-level repair, systems integration, software and cyber engineering, and field support. A key enabler of operational readiness for Joint and Allied Forces globally, TYAD leverages new and emerging technologies to further expand the Department of Defense’s organic capabilities for microelectronics, secure communications infrastructure, unmanned aerial systems, Joint All-Domain Command and Control (JADC2), Integrated Air and Missile Defense (IAMD), and the Army’s Next Generation Combat Systems (NGC2). TYAD’s ability to rapidly surge production, deploy field support teams, and scale for contingency or theater-level operations makes it a vital contributor to strategic readiness and operational reach.

The Engineering Analysis Solutions Lab (EASL) is a beta site for emerging electronics test, repair, and fabrication capabilities supporting C5ISR sustainment and maintenance operations It combines facilities, equipment and skilled technical resources required to analyze complex technical problems and develop innovative solutions.

Capabilities:

  • Advanced test, measurement and control systems development
  • Develop/improve circuit card assembly rework, repair and fabrication processes
  • Circuit card assembly engineering and reverse engineering
  • Automated surface mount technology rework, assembly and production system
  • Selective soldering system
  • Selective conformal coating system
  • 2D/3D X-ray inspection system
  • Printed circuit board cleaning system

Microelectronics

Due to the global supply chain challenges to provide domestically developed microelectronics for sustaining military weapons systems, TYAD was directed through HQAMC to develop capability in 2021 driven by a shortfall in domestic manufacturing and the introduction of counterfeit parts into the supply chain represents a significant risk to operational readiness for the Joint Force. To build out the total capability, TYAD is executing a four-phase project to prototype and produce surface mount technology circuit card assemblies (CCAs). TYAD is improving its ability to repair, build, and inspect CCAs, ensuring they last longer and stay reliable. This effort includes studying designs, analyzing supply chain risks, reverse engineering old parts, and creating replicas of outdated components. The goal is to keep the DOD’s existing equipment running, meet new technology needs, and reduce reliance on foreign suppliers. With the equipment purchased, the current capability established is to support low volume to print single layer boards for aged/legacy weapon systems experiencing obsolescence/DMSMS. TYAD Engineering has the capability and network to reverse engineer aged CCAs to build the appropriate testing files to then transition the card from the old version to the new version with updated test documentation and procedures for production.

 

Photo of equipment in the Microelectronics area Photo of equipment in the Microelectronics area

 

For additional information on these capabilities, please contact usarmy.tyad.usamc.mbx.capability-inquiry@army.mil.